Welcome to Visit Hfresh New Materials at Fispal Tecnologia 2026 (São Paulo, Booth C186)
2026-06-10
Anhui Hfresh New Materials, a professional manufacturer of high-barrier heat shrink bags, PVDC/EVA heat shrink film, chilled fresh packaging film, will attend Fispal Tecnologia 2026 in São Paulo (June 16–19, Booth C186). Join us for food safety packaging solutions.